发明授权
- 专利标题： Resin molding method, die device, and resin molded article
- 专利标题（中）： 树脂成形法，模具装置和树脂成形品
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申请号： US13102567申请日： 2011-05-06
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公开(公告)号： US08668862B2公开(公告)日： 2014-03-11
- 发明人: Keizou Matsumura , Taishi Maruichi
- 申请人： Keizou Matsumura , Taishi Maruichi
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2010-129505 20100607
- 主分类号： B29C45/56
- IPC分类号： B29C45/56 ; B29C45/73
摘要：
Flow gates 5 capable of protruding and retracting are provided in a cavity 9 of a die 2 to control a resin filling path. The generation of welds or orientation lines in a resin flow pattern is allowed only in an area containing uneven portions outside a design surface but is not allowed in other areas. The area containing welds or orientation lines in a resin flow pattern is covered with a separate component having a design surface, thereby achieving a desired metallic appearance.
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