发明授权
- 专利标题： Methods of fluxless micro-piercing of solder balls, and resulting devices
- 专利标题（中）： 无焊剂微球穿刺的方法及其结果
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申请号： US13873509申请日： 2013-04-30
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公开(公告)号： US08669173B2公开(公告)日： 2014-03-11
- 发明人: Teck Kheng Lee
- 申请人： Micron Technology, Inc.
- 申请人地址： US ID Boise
- 专利权人： Micron Technology
- 当前专利权人： Micron Technology
- 当前专利权人地址： US ID Boise
- 代理机构： Perkins Coie LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.
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