Invention Grant
- Patent Title: Methods of fluxless micro-piercing of solder balls, and resulting devices
- Patent Title (中): 无焊剂微球穿刺的方法及其结果
-
Application No.: US13873509Application Date: 2013-04-30
-
Publication No.: US08669173B2Publication Date: 2014-03-11
- Inventor: Teck Kheng Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology
- Current Assignee: Micron Technology
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.
Public/Granted literature
- US20130234328A1 METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING DEVICES Public/Granted day:2013-09-12
Information query
IPC分类:
