发明授权
- 专利标题： Flip chip semiconductor device
- 专利标题（中）： 倒装芯片半导体器件
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申请号： US13244256申请日： 2011-09-23
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公开(公告)号： US08669650B2公开(公告)日： 2014-03-11
- 发明人: Xiaotian Zhang , Hamza Yilmaz , Jun Lu , Xiaoguang Zeng , Ming-Chen Lu
- 申请人： Xiaotian Zhang , Hamza Yilmaz , Jun Lu , Xiaoguang Zeng , Ming-Chen Lu
- 申请人地址： US CA Sunnyvale
- 专利权人： Alpha & Omega Semiconductor, Inc.
- 当前专利权人： Alpha & Omega Semiconductor, Inc.
- 当前专利权人地址： US CA Sunnyvale
- 代理机构： CH Emily LLC
- 代理商 Chein-Hwa Tsao
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/02
摘要：
A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a recess area formed in the first chip installation area, and multiple metal pillars formed in the recess area, a notch divides the first chip installation area into a transverse base extending transversely and a longitudinal base extending longitudinally, and separates the recess area into a transverse recess part formed in the transverse base and a longitudinal recess part formed in longitudinal base; a portion of a transverse extending part connecting to an external pin extends into a portion inside of the notch.
公开/授权文献
- US20120248539A1 FLIP CHIP SEMICONDUCTOR DEVICE 公开/授权日：2012-10-04
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