Invention Grant
- Patent Title: Integrated circuit packaging system with die paddle and method of manufacture thereof
- Patent Title (中): 具有芯片的集成电路封装系统及其制造方法
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Application No.: US13197070Application Date: 2011-08-03
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Publication No.: US08669654B2Publication Date: 2014-03-11
- Inventor: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a single integral structure with a paddle central portion surrounded by a paddle peripheral portion; forming a terminal adjacent the package paddle; mounting an integrated circuit over the paddle central portion; and forming an encapsulation over the integrated circuit and the terminal, the encapsulation free of delamination with the encapsulation directly on the paddle peripheral portion.
Public/Granted literature
- US20120032315A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-02-09
Information query
IPC分类:
