Invention Grant
- Patent Title: Bypass fluid circulation in fluid ejection devices
- Patent Title (中): 在流体喷射装置中旁路流体循环
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Application No.: US13793416Application Date: 2013-03-11
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Publication No.: US08672463B2Publication Date: 2014-03-18
- Inventor: Kevin von Essen , Paul A. Hoisington
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Fish & Richardson P.C.
- Main IPC: B41J2/18
- IPC: B41J2/18

Abstract:
A fluid ejection device includes a fluid manifold, a substrate coupled to the fluid manifold, and a fluid distribution structure disposed between the fluid manifold and the substrate. The fluid manifold includes a fluid supply chamber and a fluid return chamber. The substrate defines a flow path including a flow path inlet for receiving fluid, a nozzle for ejecting fluid droplets, and a flow path outlet for channeling away un-ejected fluid. The fluid distribution structure includes a fluid supply channel including a supply inlet fluidically coupled to the fluid supply chamber and a supply outlet fluidically coupled to the flow path. The fluid distribution structure also includes a fluid bypass channel including a bypass inlet fluidically coupled to the fluid supply chamber, a bypass outlet fluidically coupled to the fluid return chamber, and a flow inhibitor between the bypass inlet and the bypass outlet providing a supplemental flow resistance to the fluid bypass channel. The flow inhibitor includes a convergent-divergent throat section.
Public/Granted literature
- US20130293641A1 BYPASS FLUID CIRCULATION IN FLUID EJECTION DEVICES Public/Granted day:2013-11-07
Information query
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