Invention Grant
- Patent Title: Intervertebral implant devices and methods for insertion thereof
- Patent Title (中): 椎间植入装置及其插入方法
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Application No.: US12026895Application Date: 2008-02-06
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Publication No.: US08672976B2Publication Date: 2014-03-18
- Inventor: Thomas S. Kilpela , Brian P. Janowski , Jeffrey L. Trudeau , Russell M. Pietila , Michael R. Jackson , John Sullivan
- Applicant: Thomas S. Kilpela , Brian P. Janowski , Jeffrey L. Trudeau , Russell M. Pietila , Michael R. Jackson , John Sullivan
- Applicant Address: US MI Marquette
- Assignee: Pioneer Surgical Technology, Inc.
- Current Assignee: Pioneer Surgical Technology, Inc.
- Current Assignee Address: US MI Marquette
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: A61B17/70
- IPC: A61B17/70 ; A61B17/88
Abstract:
An implant device is provided that is configured for implantation at multiple locations between adjacent vertebrae. The implant device comprises an implant body, a first portion of the implant body, and a second portion of the implant body adjustably interconnected with the first portion. The implant body has a compact orientation and an extended orientation to allow the implant body to be shifted from one orientation to the other orientation for being positioned in any one of areas between the spinous processes of the adjacent vertebrae, between laminar regions of the adjacent vertebrae, spanning an opening in the annulus between the adjacent vertebrae, and in the intervertebral space between the adjacent vertebrae.
Public/Granted literature
- US20080208344A1 Intervertebral Implant Devices and Methods for Insertion Thereof Public/Granted day:2008-08-28
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