Invention Grant
- Patent Title: Device comprising positive hole injection transport layer, method for producing the same and ink for forming positive hole injection transport layer
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Application No.: US13459700Application Date: 2012-04-30
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Publication No.: US08673185B2Publication Date: 2014-03-18
- Inventor: Shigehiro Ueno , Keisuke Hashimoto , Masato Okada , Seiji Take , Yosuke Taguchi , Masataka Kano , Shin-ya Fujimoto
- Applicant: Shigehiro Ueno , Keisuke Hashimoto , Masato Okada , Seiji Take , Yosuke Taguchi , Masataka Kano , Shin-ya Fujimoto
- Applicant Address: JP Tokyo-to
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo-to
- Agency: Ladas & Parry LLP
- Priority: JP2008-117571 20080428
- Main IPC: H01B1/12
- IPC: H01B1/12

Abstract:
The present invention is to provide a device capable of having an easy production process and achieving a long lifetime. A device comprising a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes, wherein the positive hole injection transport layer comprises a transition metal-containing nanoparticle containing at least a transition metal compound including a transition metal oxide, a transition metal and a protecting agent, or at least the transition metal compound including the transition metal oxide, and the protecting agent.
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