Disclosed herein is an electrical component including a substrate comprising an electroconductive filler in a first polymeric binder, and a coating layer adhered to at least a portion of the substrate surface, the coating layer comprising a nanostructured electroconductive particulate dispersed in a polymeric binder, such as an epoxy resin. A method of making the component also is disclosed, comprising obtaining a substrate containing an electroconductive filler in a polymeric binder, dispersing a nanostructured electroconductive particulate filler in a liquid that includes a solvent and/or a reactive diluent to form a dispersion, mixing the dispersion with a liquid resin to form a coating mixture, applying the coating mixture to the substrate, and crosslinking the applied coating mixture to form the coated substrate.