An array or moat isolation structure for eDRAM and methods of manufacture is provided. The method includes forming a deep trench for a memory array and an isolation region. The method includes forming a node dielectric on exposed surfaces of the deep trench for the memory array and the isolation region. The method includes filling remaining portions of the deep trench for the memory array with a metal, and lining the deep trench of the isolation region with the metal. The method includes filling remaining portions of the deep trench for the isolation region with a material, on the metal within the deep trench for the memory array. The method includes recessing the metal within the deep trench for the memory array and the isolation region. The metal in the deep trench of the memory array is recessed to a greater depth than the metal in the isolation region.