发明授权
US08674487B2 Semiconductor packages with lead extensions and related methods 有权
具有导线延伸和相关方法的半导体封装

Semiconductor packages with lead extensions and related methods
摘要:
A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.
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