发明授权
- 专利标题: Semiconductor packages with lead extensions and related methods
- 专利标题(中): 具有导线延伸和相关方法的半导体封装
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申请号: US13421570申请日: 2012-03-15
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公开(公告)号: US08674487B2公开(公告)日: 2014-03-18
- 发明人: Lin-Wang Yu , Ping-Cheng Hu , Che-Chin Chang , Yu-Fang Tsai
- 申请人: Lin-Wang Yu , Ping-Cheng Hu , Che-Chin Chang , Yu-Fang Tsai
- 申请人地址: TW Kaohsiung
- 专利权人: Advanced Semiconductor Engineering, Inc.
- 当前专利权人: Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址: TW Kaohsiung
- 代理机构: Klein, O'Neill & Singh, LLP
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.
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