发明授权
US08675077B2 Alignment metrology and resolution measurement system for imaging arrays
有权
用于成像阵列的对准度量和分辨率测量系统
- 专利标题: Alignment metrology and resolution measurement system for imaging arrays
- 专利标题(中): 用于成像阵列的对准度量和分辨率测量系统
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申请号: US12178488申请日: 2008-07-23
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公开(公告)号: US08675077B2公开(公告)日: 2014-03-18
- 发明人: Henry A. Hill , David W. Gardner
- 申请人: Henry A. Hill , David W. Gardner
- 申请人地址: US OR Wilsonville
- 专利权人: Flir Systems, Inc.
- 当前专利权人: Flir Systems, Inc.
- 当前专利权人地址: US OR Wilsonville
- 代理机构: Haynes and Boone, LLP
- 主分类号: H04N17/00
- IPC分类号: H04N17/00 ; H04N17/02 ; H04N3/14 ; H04N5/335 ; H04N5/225 ; G02B13/16
摘要:
An alignment metrology and resolution measurement system concurrently determines the alignment of an imaging array in six degrees of freedom relative to an external reference frame, and further determines the resolution of the imaging array. To achieve this, an image of at least three mask patterns is projected on the imaging array. First and second positions of the imaging array relative to first and second coordinate axis of the reference frame is obtained using pixel positions of the images along the first and second axis. A first rotational position of the imaging array about a third coordinate axis is obtained using pixel positions of the images along the first and second axes. The third position and the second and third rotational positions of the imaging array about the first and second coordinate axis are determined using feature widths of focus images of the patterns and distances between the mask patterns.
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