Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US13723842Application Date: 2012-12-21
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Publication No.: US08675313B2Publication Date: 2014-03-18
- Inventor: Naotaka Higuchi , Hitoki Kanagawa , Tetsuya Ohsawa , Daisuke Yamauchi
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2011-288198 20111228
- Main IPC: G11B21/21
- IPC: G11B21/21 ; G11B5/60
Abstract:
A suspension board with circuit includes a mounting portion for mounting thereon a slider, a supporting portion for supporting one end portion of the mounting portion, a facing portion facing the mounting portion to be spaced apart therefrom, and a driving portion provided between the mounting portion and the facing portion. The driving portion includes a heater; and an expansive portion which is thermally expanded by heat generated from the heater.
Public/Granted literature
- US20130170076A1 SUSPENSION BOARD WITH CIRCUIT Public/Granted day:2013-07-04
Information query
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