发明授权
- 专利标题： Module board
- 专利标题（中）： 模块板
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申请号： US13299842申请日： 2011-11-18
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公开(公告)号： US08675369B2公开(公告)日： 2014-03-18
- 发明人: Masahiro Takatori , Yukihiro Ishimaru
- 申请人： Masahiro Takatori , Yukihiro Ishimaru
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Greenblum & Bernstein P.L.C.
- 优先权： JP2005-076806 20050317
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/14 ; H05K7/00
摘要：
A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns.
公开/授权文献
- US20120063110A1 MODULE BOARD 公开/授权日：2012-03-15