发明授权
- 专利标题: Ear-muff type headset for two-way communication
- 专利标题(中): 耳罩型耳机用于双向通信
-
申请号: US12996444申请日: 2009-09-02
-
公开(公告)号: US08675897B2公开(公告)日: 2014-03-18
- 发明人: Mikio Fukuda , Tomoya Atsumi , Shouji Fujino
- 申请人: Mikio Fukuda , Tomoya Atsumi , Shouji Fujino
- 申请人地址: JP
- 专利权人: Temco Japan Co., Ltd.
- 当前专利权人: Temco Japan Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Schmeiser, Olsen & Watts, LLP
- 优先权: JP2008-227238 20080904
- 国际申请: PCT/JP2009/004319 WO 20090902
- 国际公布: WO2010/026746 WO 20100311
- 主分类号: H04R1/00
- IPC分类号: H04R1/00
摘要:
It is an object of the invention to provide a headset for performing simultaneous two-way communication or alternate two-way communication, which has excellent sound insulating properties such that external noise is not possibly mixed even when used under high noise conditions. A pair of bowl-shaped housings 1 each having an annular pad 2 attached to the rim of an opening portion are connected together through a headband 3, an acoustic speaker 5 supported by a buffer material 4 is arranged in at least one of the housings 1, and a bone conduction microphone 6 supported by the buffer material 4 such that the distal end is brought into abutment against the ear or the portion around the ear when a user wears the headset is arranged in at least one of the housings 1.
公开/授权文献
- US20110170718A1 EAR-MUFF TYPE HEADSET FOR TWO-WAY COMMUNICATION 公开/授权日:2011-07-14
信息查询