Invention Grant
- Patent Title: Base surface processing method and MEMS device
- Patent Title (中): 基面处理方法和MEMS器件
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Application No.: US13432680Application Date: 2012-03-28
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Publication No.: US08679360B2Publication Date: 2014-03-25
- Inventor: Takeshi Sakamoto , Junichi Takeuchi
- Applicant: Takeshi Sakamoto , Junichi Takeuchi
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-081651 20110401
- Main IPC: B44C1/22
- IPC: B44C1/22 ; H01L21/302
Abstract:
A base surface processing method includes forming a protective film on a base surface; thinning a part of a base by grinding a part of the base surface; and etching a ground surface ground by the thinning.
Public/Granted literature
- US20120251783A1 BASE SURFACE PROCESSING METHOD AND MEMS DEVICE Public/Granted day:2012-10-04
Information query
