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US08679587B2 Solution deposition of inorganic materials and electronic devices made comprising the inorganic materials 有权
无机材料和由无机材料制成的电子器件的溶液沉积

Solution deposition of inorganic materials and electronic devices made comprising the inorganic materials
Abstract:
Disclosed embodiments concern solution deposition of at least a first inorganic compound on a substrate, typically for production of electronic devices, such as solution deposition of metal salts, including halides, carbonyls, acetates, sulfates, phosphates, carbonates, and mixtures thereof. Solutions may be deposited using any suitable process, particularly inkjet printing or spin coating. The method can involve depositing only a first solution, depositing a first solution plural times, or deposition of plural different solutions. Furthermore, the method may involve simultaneous or serial deposition of two or more solutions. The method may further comprise post deposition processing the deposited material, such as thermal annealing, oxidation processes, reduction processes, exchange reactions, and combinations thereof. Electronic devices that can be made by the method also are described, including transistors, circuits, capacitors, photovoltaics, photodetectors, such as a UV detector, gas sensors, batteries, X-ray imagers, light emitting diodes, solid electrolytes, computer readable media, and combinations thereof.
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