Invention Grant
- Patent Title: Solution deposition of inorganic materials and electronic devices made comprising the inorganic materials
- Patent Title (中): 无机材料和由无机材料制成的电子器件的溶液沉积
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Application No.: US11564759Application Date: 2006-11-29
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Publication No.: US08679587B2Publication Date: 2014-03-25
- Inventor: Chih-hung Chang , Do-Hyoung Lee , Yu-Jen Chang
- Applicant: Chih-hung Chang , Do-Hyoung Lee , Yu-Jen Chang
- Applicant Address: US OR Corvallis
- Assignee: State of Oregon acting by and through the State Board of Higher Education action on Behalf of Oregon State University
- Current Assignee: State of Oregon acting by and through the State Board of Higher Education action on Behalf of Oregon State University
- Current Assignee Address: US OR Corvallis
- Agency: Klarquist Sparkman, LLP
- Main IPC: B05D3/02
- IPC: B05D3/02

Abstract:
Disclosed embodiments concern solution deposition of at least a first inorganic compound on a substrate, typically for production of electronic devices, such as solution deposition of metal salts, including halides, carbonyls, acetates, sulfates, phosphates, carbonates, and mixtures thereof. Solutions may be deposited using any suitable process, particularly inkjet printing or spin coating. The method can involve depositing only a first solution, depositing a first solution plural times, or deposition of plural different solutions. Furthermore, the method may involve simultaneous or serial deposition of two or more solutions. The method may further comprise post deposition processing the deposited material, such as thermal annealing, oxidation processes, reduction processes, exchange reactions, and combinations thereof. Electronic devices that can be made by the method also are described, including transistors, circuits, capacitors, photovoltaics, photodetectors, such as a UV detector, gas sensors, batteries, X-ray imagers, light emitting diodes, solid electrolytes, computer readable media, and combinations thereof.
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