发明授权
- 专利标题: Lithographic apparatus and device manufacturing method
- 专利标题(中): 平版印刷设备和器件制造方法
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申请号: US11898637申请日: 2007-09-13
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公开(公告)号: US08681308B2公开(公告)日: 2014-03-25
- 发明人: Paul Petrus Joannes Berkvens , Roelof Frederik De Graaf , Paulus Martinus Maria Liebregts , Ronald Van Der Ham , Wilhelmus Franciscus Johannes Simons , Daniel Jozef Maria Direcks , Franciscus Johannes Joseph Janssen , Paul William Scholtes-Van Eijk , Gert-Jan Gerardus Johannes Thomas Brands , Koen Steffens , Han Henricus Aldegonda Lempens , Mathieus Anna Karel Van Lierop , Christophe De Metsenaere , Marcio Alexandre Cano Miranda , Patrick Johannes Wilhelmus Spruytenburg , Joris Johan Anne-Marie Verstraete
- 申请人: Paul Petrus Joannes Berkvens , Roelof Frederik De Graaf , Paulus Martinus Maria Liebregts , Ronald Van Der Ham , Wilhelmus Franciscus Johannes Simons , Daniel Jozef Maria Direcks , Franciscus Johannes Joseph Janssen , Paul William Scholtes-Van Eijk , Gert-Jan Gerardus Johannes Thomas Brands , Koen Steffens , Han Henricus Aldegonda Lempens , Mathieus Anna Karel Van Lierop , Christophe De Metsenaere , Marcio Alexandre Cano Miranda , Patrick Johannes Wilhelmus Spruytenburg , Joris Johan Anne-Marie Verstraete
- 申请人地址: NL Veldhoven
- 专利权人: ASML Netherlands B.V.
- 当前专利权人: ASML Netherlands B.V.
- 当前专利权人地址: NL Veldhoven
- 代理机构: Pillsbury Winthrop Shaw Pittman LLP
- 主分类号: G03B27/52
- IPC分类号: G03B27/52 ; G03B27/68 ; G03B27/42 ; G03B27/32 ; G03B27/54 ; G03B27/58
摘要:
An immersion lithographic apparatus is disclosed that includes a fluid confinement system configured to confine fluid to a space between a projection system and a substrate. The fluid confinement system includes a fluid inlet to supply fluid, the fluid inlet connected to an inlet port and an outlet port. The immersion lithographic apparatus further includes a fluid supply system configured to control fluid flow through the fluid inlet by varying the flow rate of fluid provided to the inlet port and the flow rate of fluid removed from the outlet port.
公开/授权文献
- US20090073395A1 Lithographic apparatus and device manufacturing method 公开/授权日:2009-03-19