Invention Grant
- Patent Title: Modular sub-flooring system
- Patent Title (中): 模块化地板底板系统
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Application No.: US12774487Application Date: 2010-05-05
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Publication No.: US08683769B2Publication Date: 2014-04-01
- Inventor: Ronald N. Cerny , Gary L. Day , Dana Hedquist
- Applicant: Ronald N. Cerny , Gary L. Day , Dana Hedquist
- Applicant Address: US UT Salt Lake City
- Assignee: Connor Sport Court International, LLC
- Current Assignee: Connor Sport Court International, LLC
- Current Assignee Address: US UT Salt Lake City
- Agency: Thorpe North & Western LLP
- Main IPC: E04B1/38
- IPC: E04B1/38 ; E04B5/02

Abstract:
A modular sub-flooring system for supporting an overlayment above a ground surface includes a plurality of sub-floor tiles situated about a ground surface, with each sub-floor tile having a substantially-flat top surface that is adapted to receive and support an overlayment, and a connection interface with opposing engagement surfaces. The sub-flooring system also includes a plurality of removable bridge connectors, with each of the bridge connectors having a plurality of tile interfaces, and with each tile interface having complimentary engagement surfaces configured to engage with the opposing engagement surfaces of the connection interfaces. The tile interfaces of the bridge connectors couple to the respective connection interfaces of any adjacent sub-floor tiles to restrain the relative vertical movement between the adjacent sub-floor tiles while facilitating controlled relative lateral movement between the sub-floor tiles.
Public/Granted literature
- US20110179728A1 MODULAR SUB-FLOORING SYSTEM Public/Granted day:2011-07-28
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