发明授权
- 专利标题： Fluid ejection device
- 专利标题（中）： 流体喷射装置
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申请号： US13641469申请日： 2010-04-29
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公开(公告)号： US08684501B2公开(公告)日： 2014-04-01
- 发明人: James E. Abbott, Jr. , Samuel Ajayi , Sadiq Bengali , Stephen Horvath , Greg S. Long , Satya Prakash , Alfred I-Tsung Pan , Mohammed S. Shaarawi , Roberto A. Pugliese
- 申请人： James E. Abbott, Jr. , Samuel Ajayi , Sadiq Bengali , Stephen Horvath , Greg S. Long , Satya Prakash , Alfred I-Tsung Pan , Mohammed S. Shaarawi , Roberto A. Pugliese
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 代理商 Nathan R. Rieth
- 国际申请： PCT/US2010/032890 WO 20100429
- 国际公布： WO2011/136772 WO 20111103
- 主分类号： B41J2/05
- IPC分类号： B41J2/05
摘要：
A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.
公开/授权文献
- US20130044163A1 FLUID EJECTION DEVICE 公开/授权日：2013-02-21
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