Invention Grant
- Patent Title: Transfer method using thermal transfer film
- Patent Title (中): 转印方法采用热转印膜
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Application No.: US12025783Application Date: 2008-02-05
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Publication No.: US08685191B2Publication Date: 2014-04-01
- Inventor: Chen-Hua Liu , Ru-Jen Chiu , Bar-Long Denq , Hung-Jen Chen
- Applicant: Chen-Hua Liu , Ru-Jen Chiu , Bar-Long Denq , Hung-Jen Chen
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW96116603A 20070510
- Main IPC: B41M5/00
- IPC: B41M5/00 ; B44C1/165 ; B41M3/12
Abstract:
A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.
Public/Granted literature
- US20080277050A1 THERMAL TRANSFER FILM, METHOD OF MANUFACTURING THE SAME AND TRANSFER METHOD Public/Granted day:2008-11-13
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