中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US08685195B2 Soft lithographic molding of surface relief output couplers for organic light emitting diodes 失效
用于有机发光二极管的表面释放输出耦合器的软平版印刷

  • Patent Title: Soft lithographic molding of surface relief output couplers for organic light emitting diodes
  • Patent Title (中): 用于有机发光二极管的表面释放输出耦合器的软平版印刷
  • Application No.: US12161971
    Application Date: 2007-01-29
  • Publication No.: US08685195B2
    Publication Date: 2014-04-01
  • Inventor: Anne Shim , John Rogers , Feng Hua
  • Applicant: Anne Shim , John Rogers , Feng Hua
  • Agency: Brinks Gilson & Lione
  • International Application: PCT/US2007/061198 WO 20070129
  • International Announcement: WO2007/127513 WO 20071108
  • Main IPC: B29C47/00
  • IPC: B29C47/00
Soft lithographic molding of surface relief output couplers for organic light emitting diodes
Abstract:
The present invention provides a method and apparatus for surface relief output coupling in organic light emitting diodes is provided. The method includes forming a pattern in a surface of an elastomer (310) and laminating at least a portion of the pattern to a surface of an organic light emitting diode (305).
Abstract(Chinese):

本发明提供了一种用于有机发光二极管中的表面起伏输出耦合的方法和装置。 该方法包括在弹性体（310）的表面中形成图案，并将图案的至少一部分层压到有机发光二极管（305）的表面。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0