Invention Grant
- Patent Title: Packaged chip detection and classification device
- Patent Title (中): 封装芯片检测和分类装置
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Application No.: US13170705Application Date: 2011-06-28
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Publication No.: US08686310B2Publication Date: 2014-04-01
- Inventor: Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
- Applicant: Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
- Applicant Address: TW Hsinchu
- Assignee: Youngtek Electronics Corporation
- Current Assignee: Youngtek Electronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW100104785A 20110214
- Main IPC: B07C5/344
- IPC: B07C5/344

Abstract:
A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
Public/Granted literature
- US20120205297A1 PACKAGED CHIP DETECTION AND CLASSIFICATION DEVICE Public/Granted day:2012-08-16
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