发明授权
- 专利标题: Piezoelectric devices and methods for manufacturing the same
- 专利标题(中): 压电器件及其制造方法
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申请号: US13400583申请日: 2012-02-21
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公开(公告)号: US08686621B2公开(公告)日: 2014-04-01
- 发明人: Hiroki Sekiguchi
- 申请人: Hiroki Sekiguchi
- 申请人地址: JP Tokyo
- 专利权人: Nihon Dempa Kogyo Co., Ltd.
- 当前专利权人: Nihon Dempa Kogyo Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Jianq Chyun IP Office
- 优先权: JP2011-036700 20110223
- 主分类号: H01L41/053
- IPC分类号: H01L41/053
摘要:
The purpose of the present disclosure is to provide a piezoelectric device that is less likely to be damaged during the cutting process from a wafer into individual pieces, and can be measured at the wafer without being affected by adjacent piezoelectric devices. The piezoelectric device includes: a first plate which constitutes a part of the package for storing the vibrating portion, having a pair of first edges and second edges situated vertically to the first edges; a second plate bonded to the first plate and constitutes another part of the package for storing the vibrating portion; and an adhesive for bonding the first plate and the second plate together. A pair of castellations is formed on each first edge, situated symmetrical to a straight line that passes through a centerline of the first plate and is parallel to the second edge. The present disclosure also provides methods for manufacturing.