Invention Grant
- Patent Title: Microwave antenna assemblies
- Patent Title (中): 微波天线组件
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Application No.: US12886310Application Date: 2010-09-20
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Publication No.: US08686906B2Publication Date: 2014-04-01
- Inventor: Carson R. White , Hyok Jae Song , Eray Yasan
- Applicant: Carson R. White , Hyok Jae Song , Eray Yasan
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01Q1/32
- IPC: H01Q1/32

Abstract:
A microwave antenna assembly includes a first dielectric layer, a second dielectric layer, a conductive layer, a first conductive patch, and a second conductive patch. The conductive layer is disposed in an inner region between the first dielectric layer and the second dielectric layer. The conductive layer includes a slot. A first conductive patch is surrounded by the slot. The second conductive patch is disposed against the second dielectric layer outside the inner region, and is electromagnetically coupled to the first conductive patch.
Public/Granted literature
- US20120068896A1 MICROWAVE ANTENNA ASSEMBLIES Public/Granted day:2012-03-22
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