发明授权
- 专利标题: Microwave antenna assemblies
- 专利标题(中): 微波天线组件
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申请号: US12886310申请日: 2010-09-20
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公开(公告)号: US08686906B2公开(公告)日: 2014-04-01
- 发明人: Carson R. White , Hyok Jae Song , Eray Yasan
- 申请人: Carson R. White , Hyok Jae Song , Eray Yasan
- 申请人地址: US MI Detroit
- 专利权人: GM Global Technology Operations LLC
- 当前专利权人: GM Global Technology Operations LLC
- 当前专利权人地址: US MI Detroit
- 代理机构: Ingrassia Fisher & Lorenz, P.C.
- 主分类号: H01Q1/32
- IPC分类号: H01Q1/32
摘要:
A microwave antenna assembly includes a first dielectric layer, a second dielectric layer, a conductive layer, a first conductive patch, and a second conductive patch. The conductive layer is disposed in an inner region between the first dielectric layer and the second dielectric layer. The conductive layer includes a slot. A first conductive patch is surrounded by the slot. The second conductive patch is disposed against the second dielectric layer outside the inner region, and is electromagnetically coupled to the first conductive patch.
公开/授权文献
- US20120068896A1 MICROWAVE ANTENNA ASSEMBLIES 公开/授权日:2012-03-22
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