Methods of treating ink on a porous substrate and methods of printing onto porous substrates are provided. An exemplary embodiment of the methods of treating ink on a porous substrate includes applying a layer of ink onto a first surface of a porous substrate; irradiating the layer of ink with first radiation having a first spectrum effective to partially cure the ink layer and reduce penetration of the ink into pores of the substrate; leveling the partially-cured ink layer; and irradiating the as-leveled ink layer with second radiation to further cure the ink layer, the second radiation having a second spectrum different from the first spectrum of the first radiation.