发明授权
- 专利标题: Multilayer substrate
- 专利标题(中): 多层基板
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申请号: US13369363申请日: 2012-02-09
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公开(公告)号: US08692125B2公开(公告)日: 2014-04-08
- 发明人: Noboru Kato , Jun Sasaki , Satoshi Ishino
- 申请人: Noboru Kato , Jun Sasaki , Satoshi Ishino
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2009-186282 20090811
- 主分类号: H05K1/00
- IPC分类号: H05K1/00
摘要:
A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
公开/授权文献
- US20120138340A1 MULTILAYER SUBSTRATE 公开/授权日:2012-06-07
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