发明授权
- 专利标题： Wiring board capable of containing functional element and method for manufacturing same
- 专利标题（中）： 能够包含功能元件的接线板及其制造方法
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申请号： US13060990申请日： 2009-08-25
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公开(公告)号： US08692135B2公开(公告)日： 2014-04-08
- 发明人: Takuo Funaya , Shintaro Yamamichi , Daisuke Ohshima , Yoshiki Nakashima
- 申请人： Takuo Funaya , Shintaro Yamamichi , Daisuke Ohshima , Yoshiki Nakashima
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2008-218558 20080827
- 国际申请： PCT/JP2009/064757 WO 20090825
- 国际公布： WO2010/024233 WO 20100304
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/18
摘要：
A wiring board is configured by stacking one or more conductor wiring layers and one or more insulating resin layers and comprising one or more metal vias configured to penetrate the insulating resin layer, wherein the boundary surface between the metal via and the insulating resin layer has a concavo-convex boundary cross-section structure in which the metal via and the insulating resin layer are engaged with each other.
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