发明授权
- 专利标题: Semiconductor light emitting device and wafer
- 专利标题(中): 半导体发光器件和晶圆
-
申请号: US13671578申请日: 2012-11-08
-
公开(公告)号: US08692228B2公开(公告)日: 2014-04-08
- 发明人: Kei Kaneko , Yasuo Ohba , Hiroshi Katsuno , Mitsuhiro Kushibe
- 申请人: Kei Kaneko , Yasuo Ohba , Hiroshi Katsuno , Mitsuhiro Kushibe
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权: JP2008-231097 20080909
- 主分类号: H01L29/06
- IPC分类号: H01L29/06
摘要:
A semiconductor light emitting device includes a first layer including at least one of n-type GaN and n-type AlGaN; a second layer including Mg-containing p-type AlGaN; and a light emitting section provided between the first and second layers. The light emitting section includes barrier layers of Si-containing AlxGa1-x-yInyN (0≦x, 0≦y, x+y≦1), and a well layer provided between the barrier layers and made of GaInN or AlGaInN. The barrier layers have a nearest barrier layer nearest to the second layer among the barrier layers and a far barrier layer. The nearest barrier layer includes a first portion made of Si-containing AlxGa1-x-yInyN (0≦x, 0≦y, x+y≦1), and a second portion provided between the first portion and the second layer and made of AlxGa1-x-yInyN (0≦x, 0≦y, x+y≦1). The Si concentration in the second portion is lower than those in the first portion and in the far barrier layer.
公开/授权文献
- US20130112988A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND WAFER 公开/授权日:2013-05-09
信息查询
IPC分类: