Invention Grant
- Patent Title: Semiconductor devices and methods of preparation
- Patent Title (中): 半导体器件及其制备方法
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Application No.: US13455398Application Date: 2012-04-25
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Publication No.: US08692238B2Publication Date: 2014-04-08
- Inventor: Deepak Shukla , Douglas R. Robello , Mark R. Mis , Wendy G. Ahearn , Dianne M. Meyer
- Applicant: Deepak Shukla , Douglas R. Robello , Mark R. Mis , Wendy G. Ahearn , Dianne M. Meyer
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent J. Lanny Tucker
- Main IPC: H01L35/24
- IPC: H01L35/24
Abstract:
An organic film-forming polymer has a Tg of at least 70° C. and comprises a backbone comprising recurring units of Structure (A) shown in this application. These organic film-forming polymers can be used as dielectric materials in various devices with improved properties such as improved mobility.
Public/Granted literature
- US20130285061A1 SEMICONDUCTOR DEVICES AND METHODS OF PREPARATION Public/Granted day:2013-10-31
Information query
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