Invention Grant
- Patent Title: Interposer and manufacturing method thereof
- Patent Title (中): 插件及其制造方法
-
Application No.: US13484140Application Date: 2012-05-30
-
Publication No.: US08692284B2Publication Date: 2014-04-08
- Inventor: Ying-Nan Wen , Chien-Hung Liu , Wei-Chung Yang
- Applicant: Ying-Nan Wen , Chien-Hung Liu , Wei-Chung Yang
- Agency: Liu & Liu
- Priority: CN201110145328 20110531
- Main IPC: H01L29/72
- IPC: H01L29/72
Abstract:
An embodiment of the present invention provides a manufacturing method of an interposer including: providing a semiconductor substrate having a first surface, a second surface and at least a through hole connecting the first surface to the second surface; electrocoating a polymer layer on the first surface, the second surface and an inner wall of the through hole; and forming a wiring layer on the electrocoating polymer layer, wherein the wiring layer extends from the first surface to the second surface via the inner wall of the through hole. Another embodiment of the present invention provides an interposer.
Public/Granted literature
- US20120305977A1 INTERPOSER AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-12-06
Information query
IPC分类:
