发明授权
- 专利标题： Interposer and manufacturing method thereof
- 专利标题（中）： 插件及其制造方法
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申请号： US13484140申请日： 2012-05-30
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公开(公告)号： US08692284B2公开(公告)日： 2014-04-08
- 发明人: Ying-Nan Wen , Chien-Hung Liu , Wei-Chung Yang
- 申请人： Ying-Nan Wen , Chien-Hung Liu , Wei-Chung Yang
- 代理机构： Liu & Liu
- 优先权： CN201110145328 20110531
- 主分类号： H01L29/72
- IPC分类号： H01L29/72
摘要：
An embodiment of the present invention provides a manufacturing method of an interposer including: providing a semiconductor substrate having a first surface, a second surface and at least a through hole connecting the first surface to the second surface; electrocoating a polymer layer on the first surface, the second surface and an inner wall of the through hole; and forming a wiring layer on the electrocoating polymer layer, wherein the wiring layer extends from the first surface to the second surface via the inner wall of the through hole. Another embodiment of the present invention provides an interposer.
公开/授权文献
- US20120305977A1 INTERPOSER AND MANUFACTURING METHOD THEREOF 公开/授权日：2012-12-06
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