发明授权
- 专利标题: Lateral trench MESFET
- 专利标题(中): 横向沟槽MESFET
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申请号: US13152477申请日: 2011-06-03
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公开(公告)号: US08692319B2公开(公告)日: 2014-04-08
- 发明人: Franz Hirler , Andreas Peter Meiser
- 申请人: Franz Hirler , Andreas Peter Meiser
- 申请人地址: AT Villach
- 专利权人: Infineon Technologies Austria AG
- 当前专利权人: Infineon Technologies Austria AG
- 当前专利权人地址: AT Villach
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
A transistor includes a trench formed in a semiconductor body, the trench having sidewalls and a bottom. The transistor further includes a first semiconductor material disposed in the trench adjacent the sidewalls and a second semiconductor material disposed in the trench and spaced apart from the sidewalls by the first semiconductor material. The second semiconductor material has a different band gap than the first semiconductor material. The transistor also includes a gate material disposed in the trench and spaced apart from the first semiconductor material by the second semiconductor material. The gate material provides a gate of the transistor. Source and drain regions are arranged in the trench with a channel interposed between the source and drain regions in the first or second semiconductor material so that the channel has a lateral current flow direction along the sidewalls of the trench.
公开/授权文献
- US20120305987A1 LATERAL TRENCH MESFET 公开/授权日:2012-12-06
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