发明授权
- 专利标题： Integrated voltage regulator method with embedded passive device(s)
- 专利标题（中）： 嵌入式无源器件的集成稳压器方法
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申请号： US13367932申请日： 2012-02-07
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公开(公告)号： US08692368B2公开(公告)日： 2014-04-08
- 发明人: Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
- 申请人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理商 Michelle S. Gallardo
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A stacked integrated circuit (IC) device includes a semiconductor IC having an active face, and an interconnect structure. The active face receives a regulated voltage from a voltage regulator (MEG). An active portion of the VREG, which supplies the regulated voltage to the semiconductor IC is coupled to the interconnect structure. A packaging substrate includes one or more inductors including a first set of through vias. The first set of through vias are coupled to the interconnect structure and cooperate with the active portion to provide the regulated voltage for the semiconductor IC. The IC also includes a printed circuit board (PCB) coupled to the packaging substrate. The PCB includes a second set of through vias coupled to the first set of through vias. The IC also includes one or more conducting paths on the PCB. The conducting path(s) couple together at least two through vias of the second set of through vias.