Invention Grant
- Patent Title: Semiconductor chip and solar system
- Patent Title (中): 半导体芯片和太阳能系统
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Application No.: US13176797Application Date: 2011-07-06
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Publication No.: US08692369B2Publication Date: 2014-04-08
- Inventor: Kikuo Utsuno
- Applicant: Kikuo Utsuno
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volentine & Whitt, PLLC
- Priority: JP2010-266297 20101130
- Main IPC: H01L23/50
- IPC: H01L23/50

Abstract:
There is provided a semiconductor chip having four sides and being substantially formed in a rectangle, the semiconductor chip including: a first terminal which is located along one side of the four sides of the semiconductor chip and which is to be electrically connected to a solar cell outside the semiconductor chip; a second terminal which is located along the one side of the semiconductor chip and which is to be electrically connected to a secondary cell outside the semiconductor chip; and an interconnection line that electrically interconnects the first terminal and the second terminal.
Public/Granted literature
- US20120133040A1 SEMICONDUCTOR CHIP AND SOLAR SYSTEM Public/Granted day:2012-05-31
Information query
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