发明授权
- 专利标题: Electrical conductor and a production method therefor
- 专利标题(中): 电导体及其制造方法
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申请号: US13384096申请日: 2010-07-16
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公开(公告)号: US08692445B2公开(公告)日: 2014-04-08
- 发明人: Dong-Wook Lee , In-Seok Hwang , Sang-Ki Chun , Ji-Young Hwang , Hyeon Choi , Young-Jun Hong , Su-Jin Kim , Ki-Hwan Kim
- 申请人: Dong-Wook Lee , In-Seok Hwang , Sang-Ki Chun , Ji-Young Hwang , Hyeon Choi , Young-Jun Hong , Su-Jin Kim , Ki-Hwan Kim
- 申请人地址: KR Seoul
- 专利权人: LG Chem, Ltd.
- 当前专利权人: LG Chem, Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: McKenna Long & Aldridge, LLP
- 优先权: KR10-2009-0065103 20090716; KR10-2009-0065106 20090716; KR10-2010-0069157 20100716
- 国际申请: PCT/KR2010/004675 WO 20100716
- 国际公布: WO2011/008055 WO 20110120
- 主分类号: H01J5/16
- IPC分类号: H01J5/16
摘要:
Provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electro-conductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that, for at least 30% of the entire surface area of the transparent substrate, when a straight line is drawn intersecting the electroconductive pattern, the ratio of the standard deviation to the mean value of the distances between adjacent points of intersection between the straight line and the electroconductive pattern (the distance distribution ratio) is at least 2%. Also, provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electroconductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that at least 30% of the entire surface area of the transparent substrate is accounted for by continuously distributed closed motifs, and the ratio of the standard deviation to the mean value of the surface areas of the closed motifs (the surface area distribution ratio) is at least 2%.
公开/授权文献
- US20120187821A1 ELECTRICAL CONDUCTOR AND A PRODUCTION METHOD THEREFOR 公开/授权日:2012-07-26
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