Invention Grant
- Patent Title: System and method for use in determining the thickness of a layer of interest in a multi-layer structure
- Patent Title (中): 用于确定多层结构中感兴趣层的厚度的系统和方法
-
Application No.: US13021328Application Date: 2011-02-04
-
Publication No.: US08692564B2Publication Date: 2014-04-08
- Inventor: Atanu Saha , Krishnamurthy Anand , Hari Nadathur Seshadri , Karthick Vilapakkam Gourishankar , Filippo Cappuccini
- Applicant: Atanu Saha , Krishnamurthy Anand , Hari Nadathur Seshadri , Karthick Vilapakkam Gourishankar , Filippo Cappuccini
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Andrew J. Caruso
- Main IPC: G01R27/32
- IPC: G01R27/32
Abstract:
A method for use in determining the thickness of a layer of interest in a multi-layer structure. A first electrode is positioned in contact with a first surface of the multi-layer structure, and a second electrode is positioned in contact with a second surface of the multi-layer structure. The second surface is substantially opposite the first surface. The first electrode is pressed against the multi-layer structure at a predetermined sampling pressure, and the structure is optionally adjusted to a predetermined sampling temperature. The electrical impedance between the first electrode and the second electrode is measured.
Public/Granted literature
- US20120200304A1 SYSTEM AND METHOD FOR USE IN DETERMINING THE THICKNESS OF A LAYER OF INTEREST IN A MULTI-LAYER STRUCTURE Public/Granted day:2012-08-09
Information query
