发明授权
- 专利标题： Backlight module
- 专利标题（中）： 背光模组
-
申请号： US13523636申请日： 2012-06-14
-
公开(公告)号： US08696183B2公开(公告)日： 2014-04-15
- 发明人: Yi-Pai Huang , Ching-Yi Hsu , Chih-Hung Ting , Che-Hsuan Yang
- 申请人： Yi-Pai Huang , Ching-Yi Hsu , Chih-Hung Ting , Che-Hsuan Yang
- 申请人地址： TW Hsin-Chu
- 专利权人： Coretronic Corporation
- 当前专利权人： Coretronic Corporation
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 优先权： TW100211831U 20110629
- 主分类号： F21V7/22
- IPC分类号： F21V7/22 ; G02B6/42
摘要：
A backlight module has a light guide plate, a notch structure, a light absorption layer, and at least one light source. The light guide plate has a light-emitting surface and at least one side surface forming an angle with the light-emitting surface. The notch structure is continuously formed on the side surface and concave towards the inside of the light guide plate. The light absorption layer is distributed on an area substantially overlapping the notch structure, and the light source is stored in the notch structure.
公开/授权文献
- US20130336002A1 BACKLIGHT MODULE 公开/授权日：2013-12-19