Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US13523636Application Date: 2012-06-14
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Publication No.: US08696183B2Publication Date: 2014-04-15
- Inventor: Yi-Pai Huang , Ching-Yi Hsu , Chih-Hung Ting , Che-Hsuan Yang
- Applicant: Yi-Pai Huang , Ching-Yi Hsu , Chih-Hung Ting , Che-Hsuan Yang
- Applicant Address: TW Hsin-Chu
- Assignee: Coretronic Corporation
- Current Assignee: Coretronic Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW100211831U 20110629
- Main IPC: F21V7/22
- IPC: F21V7/22 ; G02B6/42

Abstract:
A backlight module has a light guide plate, a notch structure, a light absorption layer, and at least one light source. The light guide plate has a light-emitting surface and at least one side surface forming an angle with the light-emitting surface. The notch structure is continuously formed on the side surface and concave towards the inside of the light guide plate. The light absorption layer is distributed on an area substantially overlapping the notch structure, and the light source is stored in the notch structure.
Public/Granted literature
- US20130336002A1 BACKLIGHT MODULE Public/Granted day:2013-12-19
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