Invention Grant
- Patent Title: Method of forming pattern in substrate
- Patent Title (中): 在基材中形成图案的方法
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Application No.: US13670477Application Date: 2012-11-07
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Publication No.: US08697538B1Publication Date: 2014-04-15
- Inventor: Lu-Ping Chiang
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Jianq Chyun IP Office
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/44 ; H01L21/311 ; H01L21/033 ; H01L23/528 ; H01L29/06
Abstract:
A method of forming a pattern in a substrate is provided, in which the substrate having a pattern region is provided first. A plurality of stripe-shaped mask layers is formed on the substrate in the pattern region. Each of at least two adjacent stripe-shaped mask layers among the stripe-shaped mask layers has a protrusion portion and the protrusion portions face to each other. A spacer is formed on sidewalls of the stripe-shaped mask layers, wherein a thickness of the spacer is greater than a half of a distance between two of the protrusion portions. Subsequently, the stripe-shaped mask layers are removed. An etching process is performed by using the spacer as a mask to form trenches in the substrate. Thereafter, the trenches are filled with a material.
Public/Granted literature
- US20140127905A1 METHOD OF FORMING PATTERN IN SUBSTRATE Public/Granted day:2014-05-08
Information query
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