Invention Grant
- Patent Title: Semiconductor component having a micromechanical microphone structure
- Patent Title (中): 具有微机械麦克风结构的半导体部件
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Application No.: US13262905Application Date: 2010-04-06
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Publication No.: US08698255B2Publication Date: 2014-04-15
- Inventor: Frank Reichenbach , Arnim Hoechst , Thomas Buck
- Applicant: Frank Reichenbach , Arnim Hoechst , Thomas Buck
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102009026677 20090603
- International Application: PCT/EP2010/054519 WO 20100406
- International Announcement: WO2010/139496 WO 20101209
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
A simple and cost-effective form of implementing a semiconductor component having a micromechanical microphone structure, including an acoustically active diaphragm as a deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counterelement as a counter electrode of the microphone capacitor, and means for applying a charging voltage between the deflectable electrode and the counter electrode of the microphone capacitor. In order to not impair the functionality of this semiconductor component, even during overload situations in which contact occurs between the diaphragm and the counter electrode, the deflectable electrode and the counter electrode of the microphone capacitor are counter-doped, at least in places, so that they form a diode in the event of contact. In addition, the polarity of the charging voltage between the deflectable electrode and the counter electrode is such that the diode is switched in the blocking direction.
Public/Granted literature
- US20120091545A1 SEMICONDUCTOR COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE Public/Granted day:2012-04-19
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