Packaged leadless semiconductor device

Invention Grant

US08698291B2 Packaged leadless semiconductor device 有权

Title translation: 封装无引线半导体器件

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Patent Title: Packaged leadless semiconductor device
Patent Title (中): 封装无引线半导体器件
Application No.: US13326636

Application Date: 2011-12-15
Publication No.: US08698291B2

Publication Date: 2014-04-15
Inventor: Audel A. Sanchez , Fernando A. Santos , Lakshminarayan Viswanathan
Applicant: Audel A. Sanchez , Fernando A. Santos , Lakshminarayan Viswanathan
Applicant Address: US TX Austin
Assignee: Freescale Semiconductor, Inc.
Current Assignee: Freescale Semiconductor, Inc.
Current Assignee Address: US TX Austin
Main IPC: H01L23/02
IPC: H01L23/02

Abstract:

A packaged leadless semiconductor device (20) includes a heat sink flange (24) to which semiconductor dies (26) are coupled using a high temperature die attach process. The semiconductor device (20) further includes a frame structure (28) pre-formed with bent terminal pads (44). The frame structure (28) is combined with the flange (24) so that a lower surface (36) of the flange (24) and a lower section (54) of each terminal pad (44) are in coplanar alignment, and so that an upper section (52) of each terminal pad (44) overlies the flange (24). Interconnects (30) interconnect the die (26) with the upper section (52) of the terminal pad (44). An encapsulant (32) encases the frame structure (28), flange (24), die (26), and interconnects (30) with the lower section (54) of each terminal pad (44) and the lower surface (36) of the flange (24) remaining exposed from the encapsulant (32).

Abstract(Chinese):

封装的无引线半导体器件（20）包括散热器法兰（24），半导体管芯（26）使用高温管芯附接工艺耦合到该散热器法兰（24）。半导体器件（20）还包括预先形成有弯曲的端子焊盘（44）的框架结构（28）。框架结构（28）与凸缘（24）组合，使得凸缘（24）的下表面（36）和每个端子垫（44）的下部（54）处于共面对准，并且因此每个端子焊盘（44）的上部（52）覆盖在凸缘（24）上。互连件（30）将管芯（26）与端子焊盘（44）的上部（52）互连。密封剂（32）将框架结构（28），凸缘（24），模具（26）和互连件（30）与每个端子垫（44）的下部（54）和下表面（36）所述凸缘（24）保持暴露于所述密封剂（32）。

Public/Granted literature

US20130154068A1 PACKAGED LEADLESS SEMICONDUCTOR DEVICE Public/Granted day:2013-06-20

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）