Invention Grant
- Patent Title: Adaptive thermal compensation circuit and method
- Patent Title (中): 自适应热补偿电路及方法
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Application No.: US13867662Application Date: 2013-04-22
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Publication No.: US08698548B2Publication Date: 2014-04-15
- Inventor: Hung-Shou Nien , Chung-Sheng Cheng
- Applicant: Richtek Technology Corp.
- Applicant Address: TW Hsinchu
- Assignee: Richtek Technology Corp.
- Current Assignee: Richtek Technology Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW100103604A 20110131
- Main IPC: H01L35/00
- IPC: H01L35/00
Abstract:
For thermal compensation for an intrinsic element in a system, a circuit and method are proposed to predict the temperature variation caused by power loss of the intrinsic element, in addition to sense the external environment temperature variation of the intrinsic element, and thus sense the operational temperature of the intrinsic element more precisely.
Public/Granted literature
- US20130234780A1 ADAPTIVE THERMAL COMPENSATION CIRCUIT AND METHOD Public/Granted day:2013-09-12
Information query
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