Invention Grant
- Patent Title: Plant cultivating substrate and method of its manufacture
- Patent Title (中): 植物栽培基质及其制造方法
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Application No.: US10561622Application Date: 2004-06-18
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Publication No.: US08701344B2Publication Date: 2014-04-22
- Inventor: Masaki Hashimoto , Katsuro Miyagawa , Katsu Takatsuto
- Applicant: Masaki Hashimoto , Katsuro Miyagawa , Katsu Takatsuto
- Applicant Address: JP Osaka
- Assignee: Suntory Holdings Limitied
- Current Assignee: Suntory Holdings Limitied
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2003-176107 20030620
- International Application: PCT/JP2004/008606 WO 20040618
- International Announcement: WO2004/112461 WO 20041229
- Main IPC: A01G31/00
- IPC: A01G31/00
Abstract:
To provide a plant cultivating substrate which satisfies e.g. the water absorptivity required for plant cultivation, shape retentivity and flexibility and a method of manufacture thereof. In the plant cultivating substrate and the method of its manufacture, at least water-retentive filling material, water, urethane prepolymer and polyol are reacted with each other.
Public/Granted literature
- US20060248796A1 Plant cultivating base body and method of manufacturing the same Public/Granted day:2006-11-09
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