Invention Grant
- Patent Title: Method of cutting thin-walled material
- Patent Title (中): 切割薄壁材料的方法
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Application No.: US13055932Application Date: 2009-07-16
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Publication No.: US08701530B2Publication Date: 2014-04-22
- Inventor: Hiroyuki Ochiai , Masaharu Yano , Kiyoshi Fujikake , Yoshio Takimoto , Yutaka Watanabe
- Applicant: Hiroyuki Ochiai , Masaharu Yano , Kiyoshi Fujikake , Yoshio Takimoto , Yutaka Watanabe
- Applicant Address: JP Tokyo
- Assignee: IHI Corporation
- Current Assignee: IHI Corporation
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JP2008-192646 20080725; JP2009-023291 20090204
- International Application: PCT/JP2009/062912 WO 20090716
- International Announcement: WO2010/010845 WO 20100128
- Main IPC: B23B1/00
- IPC: B23B1/00

Abstract:
A method is provided to cut a thin-walled member without causing chattering vibration, without using a chattering vibration preventing retainer, that performs the following: (A) preparing a material having much stock for obtaining a thin-walled material, (B) while rotating the material about a center axis, cutting the inner round surface of the material within a predetermined range by feeding a cutting tool relative to material by the desired distance from one end side to the other end side of the material along the center axis, (C) while rotating the material about the center axis, cutting the outer round surface of the material within a predetermined range by feeding the cutting tool relative to the material by the desired distance from the one end side to the other end side of the material along the center axis, and (D) alternately repeating (B) and (C) to finish cutting the material.
Public/Granted literature
- US20110120278A1 METHOD OF CUTTING THIN-WALLED MATERIAL Public/Granted day:2011-05-26
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