Invention Grant
- Patent Title: Thermal analyzer
- Patent Title (中): 热分析仪
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Application No.: US13065687Application Date: 2011-03-28
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Publication No.: US08708556B2Publication Date: 2014-04-29
- Inventor: Kentaro Yamada , Shinya Nishimura , Hirohito Fujiwara
- Applicant: Kentaro Yamada , Shinya Nishimura , Hirohito Fujiwara
- Applicant Address: JP
- Assignee: SII NanoTechnology
- Current Assignee: SII NanoTechnology
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2010-076380 20100329; JP2010-261720 20101124
- Main IPC: G01N25/00
- IPC: G01N25/00

Abstract:
A thermal analyzer heats and cools a sample placed inside a furnace for measuring a thermal characteristic of the sample during heating and cooling. The thermal analyzer has a multilayer structure for covering the furnace and its surroundings so as to isolate the furnace and its surroundings from an external environment. The multilayer structure includes a multilayer wall with two layers formed of a material having high thermal conductivity and heat dissipation property. The two layers are spaced apart from one another to provide therebetween an interlayer that contains a substance having a heat capacity substantially equal to a gas contained in the furnace so that heat transfer between the two layers is minimized.
Public/Granted literature
- US20110235671A1 Thermal analyzer Public/Granted day:2011-09-29
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