发明授权
- 专利标题： Woven mesh substrate with semiconductor elements, and method and device for manufacturing the same
- 专利标题（中）： 具有半导体元件的编织网格基板及其制造方法和装置
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申请号： US13816858申请日： 2011-02-08
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公开(公告)号： US08709841B2公开(公告)日： 2014-04-29
- 发明人: Josuke Nakata
- 申请人： Josuke Nakata
- 申请人地址： JP Kyoto
- 专利权人： Kyosemi Corporation
- 当前专利权人： Kyosemi Corporation
- 当前专利权人地址： JP Kyoto
- 代理机构： Jordan and Hamburg LLP
- 优先权： WOPCT/JP2010/064459 20100826; WOPCT/JP2010/067376 20101004
- 国际申请： PCT/JP2011/052579 WO 20110208
- 国际公布： WO2012/026142 WO 20120301
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L27/14 ; H01L23/02
摘要：
A woven mesh substrate with semiconductor elements and a method and a device for manufacturing such a substrate, and more particularly a technique that makes it possible to exploit a woven mesh substrate with semiconductor elements in which a plurality of spherical semiconductor elements having a light receiving function or a light-emitting function are installed on a woven mesh substrate in net form that is made up from a plurality of vertical strands that are insulating and a plurality of horizontal strands that are conductive.
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