发明授权
US08710479B2 Semiconductor devices having multi-width isolation layer structures
有权
具有多宽度隔离层结构的半导体器件
- 专利标题: Semiconductor devices having multi-width isolation layer structures
- 专利标题(中): 具有多宽度隔离层结构的半导体器件
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申请号: US13544484申请日: 2012-07-09
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公开(公告)号: US08710479B2公开(公告)日: 2014-04-29
- 发明人: Dae-Won Kim , Yong-Kwan Kim
- 申请人: Dae-Won Kim , Yong-Kwan Kim
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel Sibley & Sajovec, P.A.
- 优先权: KR10-2011-0121948 20111122
- 主分类号: H01L29/02
- IPC分类号: H01L29/02
摘要:
According to example embodiments, there is provided a semiconductor device including a substrate and an isolation layer structure. The substrate includes an active region having an upper active pattern and a lower active pattern on the upper active pattern. The active region has a first aspect ratio larger than about 13:1 and a second aspect ratio smaller than about 13:1. The first aspect ratio is defined as a ratio of a sum of heights of the upper active pattern and the lower active pattern with respect to a width of the upper active pattern. The second aspect ratio is defined as a ratio of the sum of the heights of the upper active pattern and the lower active pattern with respect to a width of the lower active pattern. The isolation layer structure is adjacent to the active region.
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