发明授权
- 专利标题: Semiconductor device and method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13458042申请日: 2012-04-27
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公开(公告)号: US08710485B2公开(公告)日: 2014-04-29
- 发明人: Masumi Saitoh , Toshinori Numata , Kiwamu Sakuma , Haruka Kusai , Takayuki Ishikawa
- 申请人: Masumi Saitoh , Toshinori Numata , Kiwamu Sakuma , Haruka Kusai , Takayuki Ishikawa
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2011-100790 20110428
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L47/00
摘要:
According to one embodiment, a semiconductor device includes a fin type stacked layer structure which has first to third semiconductor layers, and first to third layer select transistors to select one of the first to third semiconductor layers. The second layer select transistor is normally on in the second semiconductor layer, and is controlled to be on or off in the first and third semiconductor layers. A channel region of the second semiconductor layer which is covered with a gate electrode of the second layer select transistor has a metal silicide.
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