Invention Grant
- Patent Title: Light-emitting device package and method of manufacturing the same
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US13365922Application Date: 2012-02-03
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Publication No.: US08710513B2Publication Date: 2014-04-29
- Inventor: Cheol-jun Yoo , Young-hee Song
- Applicant: Cheol-jun Yoo , Young-hee Song
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0013679 20110216
- Main IPC: H01L33/62
- IPC: H01L33/62
Abstract:
A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.
Public/Granted literature
- US20120205699A1 LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-08-16
Information query
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