发明授权
- 专利标题： Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent
- 专利标题（中）： 片上半导体器件包括具有含有胺系固化剂的树脂的底层填充层
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申请号： US13397098申请日： 2012-02-15
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公开(公告)号： US08710653B2公开(公告)日： 2014-04-29
- 发明人: Masatoshi Fukuda , Hiroshi Watabe
- 申请人： Masatoshi Fukuda , Hiroshi Watabe
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2011-054534 20110311
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/50
摘要：
A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less.
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